Bernier, in Advanced Flip Chip Packaging, ed. Mater.: Processes, Properties, and Interfaces, San Jose, CA, USA, 03-05 October 2007 McEwen, Characterization of a thick copper pillar bump process. Datta, Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: an overview. Henderson, Copper Pillar Bumping Technology, Semit. Chen, Micro copper pillar interconnection using thermosonic flip chip bonding. Vuppala, CFD simulation of solder paste flow and deformation behaviours during stencil printing process. (IMPACT), Taipei, Taiwan, 25-27 October 2017 Lin, Generational Changes of Flip Chip Interconnection Technology. Wu, Effects of α-Fe 2O 3 additions on assembly reliability of electroplated Sn-based solder cap on Cu pillar bump during thermal cycling. Tang, Microstructure of Sn-20In-2.8Ag solder and mechanical properties of joint with Cu. Fornaro, Thermal properties of sn-based solder alloys. Abdullah, Simulation investigations on fluid/structure interaction in the reflow soldering process of board-level BGA packaging. Khor, A review on numerical approach of reflow soldering process for copper pillar technology. The findings of this research provide valuable insights into the effects of varying Cu pillar diameters on the reflow soldering process, which can help in the development of more reliable electronic assemblies. The study also examines the effect of soldering materials on the Cu pillar bump. By coupling the thermal loads with the structural analysis using thermal FSI, Cu pillar bumps with a diameter of 0.20 mm are found to exhibit the lowest reflow temperature, minimum temperature difference, and minimum deformation and thermal stress, making them the most suitable interconnection joints for flip chip technology. A parametric study has been conducted to analyze the effect of different Cu pillar diameters on the reflow soldering process. The temperature distributions of solder and Cu pillar bumps are compared. The accuracy of the simulated reflow temperature profile has been verified by comparing it with the experimental temperature data, according to JEDEC standards. The desktop reflow oven is modeled in ANSYS FLUENT, while the ball grid array (BGA) package assembly is modeled in ANSYS STATIC STRUCTURAL. This paper aims to develop a thermal fluid–structure interaction (FSI) methodology to study the effect of different Cu pillar bump diameters on thermal and mechanical performance during the reflow soldering process.
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